The specifications for AMD's Ryzen 3000 desktop APUs, the Ryzen 5 3400G and the Ryzen 3 3200G have been leaked, giving us our first look at the kind of performance we can expect from these Zen+ chips with their on board Vega graphics cores.
The new leaks come from Chiphell, where someone managed to get hold of a couple of these chips and their official specification list. They discovered that the die size is the same under the IHS, but they destroyed the chip in the process of discovery. It turns out that these chips are soldered with a gold plating which makes a big difference in heat dissipation and is part of the reason that we see such a boosted clock speed for this generation of APUs.
The Ryzen 3 3200G will bed a four core, four thread chip, based on the 12nm Zen+ architecture. It will have a boost clock of 3.9GHz. However, according to the leaker with voltages under 1.4v you can achieve an overclock as high as 4.3Ghz, which would deliver fantastic single threaded performance for a very low-cost part.
The Ryzen 5 3400G will be a four core, eight-thread chip with a boost clock of 4.1Ghz. It too can reach around 4.3Ghz on similar voltages we're told.
Like their predecessors, these two chips will include AMD Radeon Vega cores, with eight in the 3200G and 11 in the 3400G. That will make the 3400G a much more capable gaming chip, but if its pricing is anything like the last-generation (around 70 percent higher) then the 3200G will be the much better buy. They should both offer solid entry-level gaming ability far in excess of what Intel's onboard HD graphics dies are capable of.
