Last month rumors started spreading that future Intel CPUs will use Ball Grid Array (BGA) sockets exclusively, making them inseparable from the motherboards they are attached to. Intel has finally issued a statement refuting those claims.
"Intel remains committed to the growing desktop enthusiast and channel markets, and will continue to offer socketed parts in the LGA package for the foreseeable future for our customers and the Enthusiast DIY market," the company said in an official statement. "However, Intel cannot comment on specific long-term product roadmap plans at this time, but will disclose more details later per our normal communication process."
Ball Grid Array CPUs are soldered directly to the motherboards at motherboard manufacturing plants. They are designed to reduce power consumption and cost but they also make it impossible to change the CPU without changing the motherboard as well.
AMD has already preempted Intel by announcing that their future CPUs will be removable and that they have "no plans at this time to move to BGA only packaging."
