During the Japanese Techno-Frontier exhibition, Furukawa Electric Co Ltd exhibited what they called the Third Generation Heat Sink For Playstation 3.
The new heat sink weights 350 grams compared to the first and second generations which weighted 700g and 500g respectively. It comprises of two separate parts to cover the Cell Processor and the TSX Graphics chip individually, compared both of its predecessors which comprised of a single unit each.
This news, alongside with the fact that the Playstation 3 Cell processor has been shrunk to 45nm, might mean that we are about to see the light and slim Playstation 3 come to life.
Furukawa Electric stated that the new heat sink is nearing the end of its development.
April 24, 2008 - 9:00pm
